Display device and method for manufacturing the same

ABSTRACT

A display device and a method for manufacturing the same are provided. The display device includes a first substrate, a second substrate and a light curable sealant. The first substrate has a displaying area and a non-displaying area, in which the displaying area includes a pixel array, and the non-displaying area includes a driving circuit. The driving circuit includes at least a capacitor which is made of transparent conductive material. The second substrate has an opaque area. The light curable sealant is located between the first substrate and the second substrate. When viewing from a normal vector of the first substrate or the second substrate, the light curable sealant, the capacitor and the opaque area are at least partially overlapped with each other.

RELATED APPLICATIONS

This application claims priority to China Application Serial Number201510154173.3 filed Apr. 2, 2015, which is herein incorporated byreference.

BACKGROUND

1. Field of Invention

The present invention relates to a display device. More particularly,the present invention relates to the display device and a method formanufacturing the display device in which a driving circuit is disposedon a lower substrate.

2. Description of Related Art

Generally, a display device is mainly composed of an upper substrate, alower substrate, a backlight module, an optical film, and a gate drivingcircuit and a data driving circuit for driving a pixel. With thetechnology evolution, the data driving circuit may be formed on thelower substrate to improve production efficiency and fulfill therequirement of narrowing borders. However, the gate driving circuitformed on the lower substrate is overlapped with a sealant disposedbetween the two substrates when the sealant is being cured with light,and thus the gate driving circuit would block the light and the sealantmay not be cured completely. As a result, moisture would be generatedfrom the sealant, and may corrode the gate driving circuit and causemalfunction thereof, and accordingly the reliability and the usageduration of the display device may be reduced. Therefore, improvement ofthe above-mentioned structure of the display device is an issue to besolved.

SUMMARY

An aspect of embodiments of the present invention provides a displaydevice which includes a first substrate, a second substrate and a lightcurable sealant. The first substrate has a displaying area and anon-displaying area. The displaying area includes a pixel array. Thenon-displaying area includes a driving circuit. The driving circuitincludes at least a capacitor which is made of a transparent conductivematerial. The second substrate has an opaque area. The light curablesealant is disposed between the first substrate and the secondsubstrate. The light curable sealant, the capacitor and the opaque areaare at least partially overlapped with each other when viewing from anormal vector of the first substrate or the second substrate.

In some embodiments, the transparent conductive material includes indiumtin oxide (ITO), indium zinc oxide (IZO), indium oxide or zinc oxide.

In some embodiments, the driving circuit is a gate driver including atransistor. The capacitor has a first terminal coupled to a gate of thetransistor, and a second terminal coupled to a source or a drain of thetransistor. In some embodiments, the first terminal of the capacitor iscoupled to the source or the drain of the transistor, and the secondterminal is configured to receive a signal.

In some embodiments, the pixel array includes a pixel structure. Thepixel structure includes a pixel electrode and a common electrode.Material of the pixel electrode is the same with material of the firstterminal of the capacitor, and material of the common electrode is thesame with material of the second terminal of the capacitor.

Embodiments of the present invention provide a method for manufacturinga display device. The method includes: providing a first substrate whichhas a displaying area and a non-displaying area; forming a pixel arrayin the displaying area of the first substrate; forming a driving circuitin the non-displaying area of the first substrate, in which the drivingcircuit includes at least a capacitor which is made of a transparentconductive material; disposing a light curable sealant in thenon-displaying area of the first substrate; covering the first substratewith a second substrate, in which the second substrate has an opaquearea, and the light curable sealant, the capacitor and the opaque areaare at least partially overlapped with each other when viewing from anormal vector of the first substrate or the second substrate; andemitting light from a side of the first substrate, in which the light isconfigured to penetrate the first substrate and the capacitor for curingthe light curable sealant.

In some embodiments, a procedure of forming the pixel array and thedriving circuit includes: forming a first patterned metal layer on thefirst substrate, in which the first patterned metal layer includes agate in the displaying area; forming an insulating layer on the gate;forming a first patterned transparent conductive layer on the insulatinglayer, in which the first patterned transparent conductive layerincludes a pixel electrode in the displaying area and a first terminalof the capacitor; forming a patterned semiconductor layer on theinsulating layer; forming a second patterned metal layer on theinsulating layer, in which the second patterned metal layer extendstoward the pixel electrode; forming a patterned protection layercovering the patterned semiconductor layer and the patterned secondmetal layer, in which the patterned protection layer extends toward thenon-displaying area to cover the first patterned transparent conductivelayer; and forming a second patterned transparent conductive layer onthe patterned protection layer, in which the second patternedtransparent conductive layer includes a common electrode in thedisplaying area and a second terminal of the capacitor.

In summary, the driving circuit has at least a capacitor made oftransparent conductive material, and therefore the light can penetratethe capacitor to cure the light curable sealant in the display deviceand method provided by the embodiments. It prevents the driving circuitof the display device from being damaged from the moisture, and thus thereliability and the utility of the display device can be increased.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and advantages of the presentinvention will become more apparent upon consideration of the followingdescription of preferred embodiments taken in conjunction with theaccompanying drawing figures.

FIG. 1 is a diagram illustrating a cross-sectional view of a displaydevice according to an embodiment.

FIG. 2 is a diagram illustrating a cross-sectional view of a capacitor201 and a pixel structure 202 according to an embodiment.

FIG. 3 is a diagram illustrating part of the gate driving circuitaccording to an embodiment.

FIG. 4 is a diagram illustrating part of the gate driving circuitaccording to an embodiment.

DETAILED DESCRIPTION

Specific embodiments of the present invention are further described indetail below with reference to the accompanying drawings, however, theembodiments described are not intended to limit the present inventionand it is not intended for the description of operation to limit theorder of implementation. Moreover, any device with equivalent functionsthat is produced from a structure formed by a recombination of elementsshall fall within the scope of the present invention. Additionally, thedrawings are only illustrative and are not drawn to actual size.

The using of “first”, “second”, etc. in the specification should beunderstood for identifying units or parts described by the sameterminology, but are not referred to particular order or sequence. Inother words, terms “first” and “second” can be switched in someembodiments. Moreover, the drawings are just schematic, and additionallayers may be formed between any two layers based on the practicalrequirement.

FIG. 1 is a diagram illustrating a cross-sectional view of a displaydevice according to an embodiment. Referring to FIG. 1, a display device100 includes a first substrate 110 (also referred to a lower substrate),a driving circuit 132, a pixel array 131, a light curable sealant 141,liquid crystal 142, a black matrix 151 and a second substrate 150 (alsoreferred to a upper substrate). For simplification, not all componentsof the display device 100 are shown in FIG. 1. For example, the displaydevice 100 may further include a backlight module, a color filter, apolarization sheet, etc. In addition, the components in FIG. 1 are notdrawn to actual sizes. The display device 100 may be implemented as avariety of display panels such as amorphous silicon (a-Si) displaypanel, low temperature poly-silicon (LTPS) display panel, IGZO displaypanel, etc., and the invention is not limited thereto.

The first substrate 110 has a displaying area 122 and a non-displayingarea 121. The pixel array 131 is disposed in the displaying area 122,and the driving circuit 132 is disposed in the non-displaying area 121.In the embodiment, the driving circuit 132 includes at least onecapacitor 201 which is made of transparent conductive material. Thetransparent conductive material may include indium tin oxide (ITO),indium zinc oxide (IZO), indium oxide, zinc oxide, or other suitablematerial. The second substrate 150 has an opaque area such as the blackmatrix 151. The light curable sealant 141 is disposed in thenon-displaying area 121 between the first substrate 110 and the secondsubstrate 150, and the light curable sealant 141 surrounds the liquidcrystal 142. In particular, the light curable sealant 141, the capacitor201 in the driving circuit 132, and the black matrix 151 are at leastpartially overlapped with each other when viewing from normal vectors(e.g. a normal vector 152) of the first substrate 110 or the secondsubstrate 150. In general, the black matrix 151 is opaque, and hencelight is emitted upwards for curing the light curable sealant 141. Inthe embodiment, the emitted light can penetrate the capacitor 201because the capacitor 201 is made of the transparent conductivematerial, and therefore the light curable sealant 141 is cured byadequate irradiation. It prevents the light curable sealant 141 frombeing cured incompletely. The incomplete irradiation may producemoisture to corrode the driving circuit 132 and cause malfunction of thedriving circuit 132.

In some embodiments, a method for manufacturing the display device 100is described below. First, first substrate 110 is provided, the pixelarray 131 is formed in the displaying area 122 on the first substrate110, and the driving circuit 132 is formed in the non-displaying area121 on the first substrate 110. Next, the liquid crystal 142 is injectedinto the displaying area 122, and the light curable sealant 141 isdisposed in the non-displaying area 121. Then, the first substrate 110is covered with the second substrate 150, and light 160 is emittedupwards from a lower side of the first substrate 110 opposite to thesecond substrate 150. The light 160 is configured to penetrate the firstsubstrate 110 and the capacitor 201 in the driving circuit 132 forcuring the light curable sealant 141. In the embodiment, the lightcurable sealant 141 may be an UV sealant, and the first substrate 110and/or the second substrate 150 may be glass, other hard material, or aflexible substrate.

The pixel array 131 includes multiple pixel structures. In someembodiments, material of pixel electrodes of the pixel structures arethe same with material of a first terminal of the capacitor 201, andmaterial of common electrodes of the pixel structures are the same withthat of a second terminal of the capacitor 201. As a result, it justneeds one process to form the pixel electrode (or common electrode) andthe first terminal (or second terminal) of the capacitor 201 whenmanufacturing the display device 100.

For example, referring to FIG. 2, FIG. 2 is a diagram illustrating across-sectional view of a capacitor 201 and a pixel structure 202according to an embodiment. Steps of forming the capacitor 201 and thepixel structure 202 are described as follows. First, a first patternedmetal layer 210 is formed on the first substrate 110. The firstpatterned metal layer 210 includes a gate 212 (i.e. the gate of a thinfilm transistor) in the displaying area 122. Next, an insulating layer220 is formed to cover the substrate 110 and the gate 212. A firstpatterned transparent conductive layer 240 is formed on the insulatinglayer 220. The first patterned transparent conductive layer 240 includesa pixel electrode 242 in the displaying area 122 and a first terminal244, which is a lower electrode of the capacitor 201, in thenon-displaying area 121. Then, a patterned semiconductor layer 250 isformed on the insulating layer 220. The patterned semiconductor layer250 is taken as a channel of the thin film transistor. Then, a secondpatterned metal layer 260 is formed on the insulating layer 220 andextends towards the pixel electrode 242. The second patterned metallayer 260 is taken as a source and a drain of the thin film transistor.A patterned protection layer 270 is formed to cover the patternedsemiconductor layer 250 and the second patterned metal layer 260. Thepatterned protection layer 270 extends toward the non-displaying area121 to cover the first patterned transparent conductive layer 240 (i.e.the first terminal 244). Then, a second patterned transparent conductivelayer 280 is formed on the patterned protection layer 270, in which thesecond patterned transparent conductive layer 280 includes a commonelectrode 282 in the displaying area 122 and a second terminal 284,which is an upper electrode of the capacitor 201, in the non-displayingarea 121.

In another embodiment, The first patterned transparent conductive layer240 includes a common electrode (not shown) in the displaying area 122and a lower electrode of the capacitor 201 in the non-displaying area121, and the second patterned transparent conductive layer 280 includesa pixel electrode (not shown) in the displaying area 122 and an upperelectrode of the capacitor 201 in the non-displaying area 121.

Herein, material of the first patterned transparent conductive layer 240and the second patterned transparent conductive layer 280 includes ITO,IZO, indium oxide, zinc oxide or other suitable material. In otherwords, the first terminal 244 and the second terminal 284 are twoterminals of the capacitor 201. In some embodiments, material of thefirst patterned metal layer 210 and/or the second patterned metal layer260 may include copper, aluminum, tungsten, metal alloys, metal silicideor other similar material. The insulating layer 220 may include siliconmaterial such as silicon oxide or SiNx. In addition, the patternedsemiconductor layer 250 may include material such as amorphous silicon,polycrystalline silicon or indium gallium zinc oxide (IGZO). Material ofthe patterned protection layer 270 may include dielectric material suchas SiNx. Note that the first terminal 244 of the capacitor 201 and thepixel electrode 242 are made with the same material and in the sameprocess in the embodiment, and therefore there is a process advantage.

In some embodiments, the driving circuit 132 is a gate driving circuit(also referred to a gate driver). There are several parasiticcapacitance problems in the gate driver, and hence we need additionalcapacitors to compensate the parasitic capacitance. Alternatively, theadditional capacitors may have discharge functions or other functions.In some embodiments, if the gate driving circuit needs at least acapacitor with large capacitance, then the capacitor may be made of thetransparent conductive material, but the invention is not limitedthereto.

For example, in some embodiments, the first terminal of the capacitor201 is coupled to a gate of a transistor, and the second terminal of thecapacitor 201 is coupled to a source or a drain of the transistor.Referring to FIG. 3, FIG. 3 is a diagram illustrating part of the gatedriving circuit according to an embodiment. Part of a shift register isshown in FIG. 3, and the circuit has a first transistor M1, a secondtransistor M2, a third transistor M3 and a capacitor Cx. A gate of thetransistor M2 receives an input signal IN1, a drain of the transistor M2receives a forward voltage from a previous stage of the shift register.A source of the transistor M3 is coupled to a source of the transistorM2, a gate of the transistor M3 receives an input signal IN2, and adrain of the transistor M3 receives a backward voltage from a next stageof the shift register. A first terminal of the capacitor Cx is coupledto a gate of the transistor M1, and a second terminal of the capacitorCx is coupled to the source of the transistor M1. A drain of thetransistor M1 is coupled to a clock signal CN. In the embodiment, thecapacitor Cx is made of the transparent conductive material.

In some embodiments, the first terminal of the capacitor made of thetransparent conductive material is coupled to a source or a drain of atransistor, and the second terminal thereof is configured to receive asignal. For example, referring to FIG. 4, FIG. 4 is a diagramillustrating part of the gate driving circuit according to anembodiment. Not like the embodiment of FIG. 3, the shift register inFIG. 4 further includes transistors M4-M7. A first terminal of acapacitor Cc is coupled to a source of the transistor M7, and a secondterminal of the capacitor Cc is coupled to a clock signal C3. A gate ofthe transistor M5 is coupled to a clock signal C1. Not all couplerelationships in FIG. 4 are described herein. In the embodiment of FIG.4, the capacitors Cx and Cc are made of the transparent conductivematerial. It is worth mentioning that the circuits in FIG. 3 and FIG. 4are just examples, and which capacitor in the gate driving circuit ismade of the transparent conductive material is not limited in theinvention.

Although the present invention has been described in considerable detailwith reference to certain embodiments thereof, other embodiments arepossible. Therefore, the spirit and scope of the appended claims shouldnot be limited to the description of the embodiments contained herein.It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentinvention without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present inventioncover modifications and variations of this invention provided they fallwithin the scope of the following claims.

What is claimed is:
 1. A display device, comprising: a first substratehaving a displaying area and a non-displaying area, wherein thedisplaying area comprises a pixel array, and the non-displaying areacomprises a driving circuit, and the driving circuit comprises at leasta capacitor which is made of transparent conductive material; a secondsubstrate having an opaque area; and a light curable sealant disposedbetween the first substrate and the second substrate, wherein the lightcurable sealant, the capacitor and the opaque area are at leastpartially overlapped with each other when viewing from a normal vectorof the first substrate or the second substrate.
 2. The display device ofclaim 1, wherein the transparent conductive material comprises indiumtin oxide (ITO), indium zinc oxide (IZO), indium oxide or zinc oxide. 3.The display device of claim 1, wherein the driving circuit is a gatedriver comprising at least a transistor, and the capacitor has a firstterminal coupled to a gate of the transistor, and a second terminalcoupled to a source or a drain of the transistor.
 4. The display deviceof claim 1, wherein the driving circuit is a gate driver comprising atleast a transistor, and the capacitor has a first terminal coupled to asource or a drain of the transistor, and a second terminal configured toreceive a signal.
 5. The display device of claim 1, wherein the pixelarray comprises a pixel structure, and the pixel structure comprises apixel electrode and a common electrode, and material of the pixelelectrode is the same with material of a first terminal of thecapacitor, material of the common electrode is the same with material ofa second terminal of the capacitor.
 6. A method for manufacturing adisplay device, the method comprising: providing a first substrate whichhas a displaying area and a non-displaying area; forming a pixel arrayin the displaying area on the first substrate; forming a driving circuitin the non-displaying area on the first substrate, wherein the drivingcircuit comprises as least a capacitor which is made of transparentconductive material; disposing a light curable sealant in thenon-displaying area on the first substrate; covering the first substratewith a second substrate, wherein the second substrate has an opaquearea, and the light curable sealant, the capacitor and the opaque areaare at least partially overlapped with each other when viewing from anormal vector of the first substrate or the second substrate; andemitting light from a side of the first substrate opposite to the secondsubstrate, wherein the light is configured to penetrate the firstsubstrate and the capacitor for curing the light curable sealant.
 7. Themethod of claim 6, wherein the transparent conductive material comprisesindium tin oxide (ITO), indium zinc oxide (IZO), indium oxide or zincoxide.
 8. The method of claim 6, wherein the driving circuit is a gatedriver comprising at least a transistor, and the capacitor has a firstterminal coupled to a gate of the transistor, and a second terminalcoupled to a source or a drain of the transistor.
 9. The method of claim6, wherein the driving circuit is a gate driver comprising at least atransistor, and the capacitor has a first terminal coupled to a sourceor a drain of the transistor, and a second terminal configured toreceive a signal.
 10. The method of claim 6, wherein a procedure offorming the pixel array and the driving circuit comprises: forming afirst patterned metal layer on the first substrate, wherein the firstpatterned metal layer comprises a gate in the displaying area; formingan insulating layer on the gate; forming a first patterned transparentconductive layer on the insulating layer, wherein the first patternedtransparent conductive layer comprises a pixel electrode in thedisplaying area and a first terminal of the capacitor; forming apatterned semiconductor layer on the insulating layer; forming a secondpatterned metal layer on the insulating layer, wherein the secondpatterned metal layer extends toward the pixel electrode; forming apatterned protection layer covering the patterned semiconductor layerand the patterned second metal layer, wherein the patterned protectionlayer extends toward the non-displaying area to cover the firstpatterned transparent conductive layer; and forming a second patternedtransparent conductive layer on the patterned protection layer, whereinthe second patterned transparent conductive layer comprises a commonelectrode in the displaying area and a second terminal of the capacitor.